LOCTITE ES6010
Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics
Main features
- Low-Viscosity Electronics Potting
- 80-to-100-Minute Working Time
- Room-Temperature or Heat Cure
Product Description
LOCTITE STYCAST ES 6005 / ES 6010 is a two-component, low-viscosity epoxy potting and encapsulating system. Black ES 6005 resin and clear ES 6010 hardener mix at 3.1:1 by volume or 100:20 by weight to produce a black compound with a typical mixed viscosity of 1,700 mPa s at 25 deg C. The system has an 80 to 100 minute working time for a 200 g mass at 25 deg C and cures at room temperature. The cured material is resilient, reaches Shore D 80 hardness and has electrical insulation properties for general-purpose electronics potting.
Key features
- Low mixed viscosity: A typical mixed viscosity of 1,700 mPa s at 25 deg C supports cavity filling.
- Extended working time: The mixed 200 g mass provides 80 to 100 minutes of working time at 25 deg C.
- Room-temperature cure: The system cures in 24 hours at 25 deg C, with a 2 hour cure at 66 deg C.
Applications
Applications include general-purpose potting and encapsulation of electronic assemblies using the complete ES 6005 / ES 6010 system.
TDS, SDS & Technical Documents
Technical Specifications
Physical Properties
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied properties
Component and mixed-system values before cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Resin appearance | Black | LOCTITE STYCAST ES 6005, Component A | |
| Hardener appearance | Clear | LOCTITE STYCAST ES 6010, Component B | |
| Mix ratio by volume | 3.1:1 | Part A to Part B | |
| Mix ratio by weight | 100:20 | Component A to Component B | |
| Resin viscosity | 11,000 | mPa s | Spindle 5, 20 rpm, 25 deg C |
| Hardener viscosity | 180 | mPa s | Spindle 1, 20 rpm, 25 deg C |
| Mixed viscosity | 1,700 | mPa s | Spindle 4, 2 rpm, 25 deg C |
| Working time | 80 to 100 | minutes | 200 g mass at 25 deg C |
Final-state properties
Typical cured-system values; recommended cure is 24 hours at 25 deg C or 2 hours at 66 deg C.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Shore hardness | 80 | Shore D | Typical cured system |
| Glass transition temperature | 27 | deg C | Typical cured system |
| Coefficient of thermal expansion below Tg | 44 x 10^-6 | mm/mm deg C | Typical cured system |
| Coefficient of thermal expansion above Tg | 130 x 10^-6 | mm/mm deg C | Typical cured system |
| Dielectric strength | 365 | V/mil | Typical cured system |
| Dielectric constant / dissipation factor | 4.37 / 0.008 | At 1 kHz and 25 deg C | |
| Volume resistivity | 6.03 x 10^14 | ohm-cm | Typical cured system |
| Insulation resistance | 1.14 x 10^13 | ohms | Typical cured system |
