PIT1S-ESD | 1-mil Antistatic ESD Polyimide (Kapton) Tape with Silicone Adhesive

Harmonization Code : 3919.90.80.99 | Polyacrylic plates / sheets / film / tape / strip, self-adhesive, in rolls

1-mil Antistatic ESD Polyimide (Kapton) Tape Silicone PIT1S-ESD | 1-mil Antistatic ESD Polyimide (Kapton) Tape with Silicone Adhesive

Main features

  • 1 mil polyimide film
  • Silicone adhesive
  • >6,500V breakdown voltage

Product Description

LINQTAPE™ PIT1S-ESD Series is a high-temperature resistant, antistatic-treated polyimide film mounted with a silicone adhesive. It is designed for both masking and temporary bonding in many high-temperature applications in semiconductor, electronic, automotive, and other general manufacturing industries.

LINQTAPE™ PIT1S-ESD Series provides an excellent balance of electrical, mechanical, thermal, and chemical properties over a wide range of temperatures. It has enhanced strength for puncture and tear resistance and can be used in applications that may see intermittent temperatures up to 260°C (500°F).

LINQTAPE™ PIT1S-ESD Series comes as a standard in 36-yard (33m) lengths of varying widths, but longer rolls may be available upon request.

 

Key Features:

  • Antistatic coating to dissipate electrostatic charge
  • Pressure-sensitive silicone adhesive
  • Excellent insulating properties
Product Family

LINQ PIT1S-ESD

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Price starting from $5.36
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Packaging
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TDS, SDS & Technical Documents

Technical Specifications

Thermal Properties
Temperature Resistance
260 ˚C
Electrical Properties
Breakdown Voltage
6500 V
General Properties
Adhesive Layer
Silicone
Adhesive Thickness
38.1 µm
Chemistry Type
Polyimide
Color
Amber
Film Thickness
25.4 µm
Release Liner
None
Single or Double-Sided Adhesive
Single-Sided
Special Layer
Antistatic Polymer Coating
Total Thickness
63.5 μm
Other Properties
RoHS Compliant
Yes
VOC-Free (100% solids content)
Yes
Mechanical Properties
Adhesion Strength
25 Oz/in
Elongation
55 %
Tensile Strength (Thin Film)
52 N/cm

Additional Information

Application Ideas

  • Dissipate electrostatic charges
  • Ideal for wafer dicing and die-cutting
  • Temporary bonding of thermocouples for oven profiling
  • Bonding of devices before solder reflow
  • Splicing of insulation layers

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